The present work aimed to verify the effects of conduction heat transfer concepts in
thermal dissipation projects of GPU memory chips operation stability. Conduction heat
transfer concepts will be presented, describing the importance of thermal interface
materials, highlighting the impact of duty cycle in the design, pointing out the effects of
working temperature in electronic equipment evaluating how to improve its heat
dissipation and testing a way to increase its work stability. Bibliographic research was
used, in addition to the case study developed from an experiment with boards from a
processing complex. Measurements were performed through the processing software
itself, obtaining the simple average and presenting the percentage gains. The change
allowed for an average reduction of 10% in the working temperature, 19% in the use
of fans and a slight reduction of 1% in the energy consumption of the equipment in
operation. Finally, the work demonstrated the efficiency of the observed solution,
bringing to light relevant knowledge for the decision-making of the population in
question about the decision to apply the improvement in their equipment.
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