This work addresses the importance and impacts of Surface Mount Technology (SMT) in the contemporary electronics industry. The research highlights the fundamental principles behind the SMT process, analyzing its crucial role in the efficiency and performance of modern electronic devices. Initially, the transition from conventional assembly technology to SMT is explored, highlighting the advantages that have driven this change, such as reduced space, greater automation and efficiency in production. The study delves into the key aspects of the SMT process, from the components and equipment used to the reflow soldering techniques and quality inspection. In addition, the challenges faced in deploying SMT are examined, such as the need for specialized skills and the complexity of reworking faulty welds. At the same time, strategies to optimize the process are presented, aiming to maximize the efficiency and quality of the final products. Through parameter adjustments, focusing on the use of Fuji Flexa software and the application of the OEE (Overall Equipment Efficiency) performance indicator, a reduction in cycle time from 64.98 seconds to 53.88 seconds was obtained, furthermore, the number of defective boards decreases from 8 to just 2, the adaptations in the parameters reflected directly on the OEE. The analysis of the OEE before and after the changes showed a notable increase, from 70.08% to 80.85%. These results indicate a faster, more efficient, and higher quality production, highlighting the effectiveness of the strategies implemented. Future trends are also highlighted, pointing to the continued potential for improvement and development of the SMT process to meet the growing demands of the electronics industry.
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